Thomas Meidlinger
Group Manager Module Hot-Implant
TDK-Micronas GmbH
We use a Siconnex Batchspray Autoload since many years for Pre-Diffusion Clean now and achieved better quality while reducing the amount of process media consumed significantly and improvement of the subsequent thermally grown oxide.
The combination of higher product performance and yield with lower cost per wafer was impressive and well appreciated. Especially when cleanroom space is a limitation, the high throughput on a compact footprint is a nice benefit as well.
General features
- Solvent replacement: Replace your solvents for polymer removal after dry etching.
- H2SO4 & H2O2 replacement: Replace sulfuric acid & hydrogen peroxide for RCA clean.
- FSI replacement: Replace FSI processes with cost-efficient sicOzone™ for photoresist strip applications.
- Throughput up to 500 wph: Intelligent wafer handling meets experienced wafer processing.
- Fully automated: A robot transfers the wafer batch from loadport into the process chamber.
- 4 process chambers: Clever assembly of process modules.
- Footprint <12 m²: Small process module footprint combined with smart wafer handling.
- Highly diluted single-use chemical: The inline spiking technology allows for spiking tiny amounts of acids into a DI water flow.