DNA of our equipment
BATCHSPRAY® Technology
BATCHSPRAY®, our core technology of all our wet chemistry equipment, offers efficient chemical-based cleaning, etching, rinsing, and drying within a versatile process chamber. It accommodates one carrier with 25 wafers or two carriers with 50 wafers and can run up to four chambers simultaneously, achieving throughputs of up to 600 wafers per hour.
General features
- Non-uniformity <1%: Controlled wafer rotation combined with smart chemical spray gain leads to excellent uniformity.
- Throughput up to 150 wph: Intelligent wafer handling meets experienced wafer processing.
- Semi-automated: Once the batch is transferred to the chamber, the process flow is automated through several process steps.
- Footprint 2 m²: Small process module footprint combined with smart wafer handling.
- Chemical recirculation by tank system: Recirculation of the chemical provides a stable temperature and concentration condition.
- Processes on SiC/GaN: Processes for SiC and GaN substrates are available.
- Extractable process chamber: Extractable process chamber for easy servicing.
- 25 or 50 wafer chamber available